Soldering Techniques for Electronic Components

Introduction

Overview of soldering electronic components to printed circuit boards (PCBs).
Discussion of three forms of solder and flux, which removes oxidation and prepares metal for bonding.

Purpose: Used for Surface Mount Technology (SMT) components.
Materials: Solder paste (flux with tiny solder balls).
Process:
- Apply solder paste to the board using a stencil.
- Use robotic pick-and-place system to position components.
- Place board in reflow oven with multiple temperature zones.
- Heat slowly, allowing flux to work and solder beads to melt, flow, cool, and solidify.
- For double-sided SMT: repeat process on second side, ensuring bottom side doesn't overheat.
- Design for manufacturing: place heavier components on the "top" side.

Purpose: Used for through-hole and mixed technology boards.
Process:
- Spray underside with flux as boards enter machine.
- Heat board gradually, allowing flux to evaporate before passing through molten solder wave.
- Utilize controlled solder waves to fill board areas.
- For double-sided boards:
  - Place SMT components on one side using glue.
  - Place through-hole components on other side.
  - SMT components soldered on underside along with through-hole pins.
Tools: Use a thermal profiler for programming temperature zones.

Purpose: Best for components unsuitable for oven processes.
Examples: Lithium batteries, tall or unstable components.
Method:
- Use solder wire with flux core.
- Utilize fixtures for precise mounting angles.

Certification: Adherence to IPC standards.
Training:
- Initial 40-hour classroom course.
- Re-certification every two years.
- Includes online and hands-on exam.
- Participants assemble test boards, assessed by certified trainer.
Z-AXIS Training:
- Certified trainer on staff for IPC-A-610 and IPC J-STD.

Topics not covered in detail: leaded vs. lead-free solder, water-soluble vs. no-clean flux, thermal profiling.
Invitation to explore related videos or contact for more information.