Lecture on Semiconductor Developments and TSMC

Introduction

Semiconductors are crucial for modern technology.
Taiwan Semiconductor Manufacturing Company (TSMC) produces about 90% of the world's most advanced chips.
TSMC's new technology aims to go beyond 1nm.

Historical Progress

TSMC started in 1987 with a 3 micrometers (3000nm) chip.
Current technology is at 1.6nm, showcasing a 99.99% reduction in size.
New materials and transistor architectures, like CFET, are key to future advancements.

Transistor Technology

Planar Transistors

Basic structure: source, drain, and gate.
Effective until the 22nm process; struggled with electron tunneling issues.

FinFET Architecture

Introduced to enhance gate control by wrapping the gate around the channel.
Improved performance and efficiency.
First used by Intel in 2012 at the 22nm process node.

Gate-All-Around (GAA) Architecture

Involves horizontal nano sheets stacked vertically.
Provides better electrostatic control and reduces leakage.
Currently starting mass production in N2 technology for high-performance devices.

TSMC's Technological Advances

New Transistor Designs

Transitioning from FinFET to GAA architecture.
Development of CFET (Complementary FET) architecture, stacking PMOS and NMOS transistors vertically.
Challenges include complex vertical interconnects and thermal management.

Material Innovations

Focus on 2D materials to overcome silicon limitations.
TMD materials are under research for atomic thin channel transistors.

Manufacturing and Tools

Lithography and Other Tools

EUV lithography machines are less critical as new processes evolve.
Atomic layer deposition and epitaxial growth become essential.
Key companies: Applied Materials, ASM, and LAM Research for various tool needs.

Backside Power Delivery

Offloading power distribution to the wafer's bottom.
Reduces metal layer congestion and decreases costs.

TSMC Stock and Global Strategy

Recent stock decline due to potential US tariffs.
TSMC plans to invest $100 billion in US manufacturing facilities.
Expansion includes fabs, packaging facilities, and R&D labs.

Future of Semiconductors

AI and high-performance computing drive demand for more computing power.
Energy efficiency becomes critical as power grid limits are reached.
Advances needed in materials, transistor architecture, cooling, and more.

Conclusion

Technology's rapid advancement demands a multifaceted approach.
Integration of novel materials, transistor designs, cooling, and power management is essential.

Call to Action

Engage with content on Hostinger Horizons, AI-generated web apps, and semiconductor innovations.
Support TSMC's ongoing developments via investments and awareness.

These notes summarize the critical aspects discussed in the lecture on semiconductor advancements and TSMC's role in the industry. They provide a concise reference for understanding the technological progress and future directions of semiconductor technology.

Semiconductor Innovations and TSMC's Role