Understanding the Semiconductor Industry

The semiconductor industry is interconnected and constantly evolving. This presentation focuses on the essential manufacturing processes of semiconductors.

Overview of Semiconductor Manufacturing Processes

1. Key Processes:
   • Wafer Manufacturing
   • Oxidation
   • Photolithography
   • Etching
   • Deposition
   • Ion Implementation
   • Metal Wiring
   • EDS (Electrical Diagnostics)
   • Packaging

1. Wafer Manufacturing

• Foundation for Semiconductors:
  • Made from silicon extracted from sand.
  • Process:
    1. Sand is heated to melt into high-purity liquid silicon.
    2. Solidification forms a silicon rod (Ingot).
    3. Ingots are sliced into thin discs (Wafers).
• Surface Preparation:
  • Wafers are polished to remove defects which could affect circuit precision.
  • Larger diameters of wafers lead to more chips produced.

2. Oxidation Process

• Purpose:
  • To create a uniform oxide film on the wafer surface.
  • Protects against current leakage and defects during further processes.

3. Photolithography Process

• Circuit Design Application:
  • Similar to developing photos on film.
  • Involves the use of a photomask and photoresist material.
  • Pattern is imprinted by exposing light to photoresist, followed by a developer to remove unlit areas.

4. Etching Process

• Material Removal:
  • Unnecessary materials are selectively removed to retain the desired circuit design.
  • Types:
    • Wet etching (chemical solutions)
    • Dry etching (gas/plasma)

5. Deposition Process

• Coating:
  • Thin films are coated on the wafer to give electrical characteristics.
  • Requires precise technology for uniform application.

6. Ion Implementation

• Conductivity Enhancement:
  • Silicon wafers are non-conductive; impurities are added to create conductive properties.

7. Metal Wiring Process

• Electrical Path Creation:
  • Deposits a thin metal film (e.g., aluminum, titanium, tungsten) to allow electricity flow.

8. EDS (Electrical Diagnostics)

• Testing:
  • Ensures the quality and functionality of semiconductor chips.
  • Yield percentage indicates the number of functional chips relative to the total.

9. Packaging Process

• Final Assembly:
  • Wafers are cut into individual chips.
  • Chips must have pathways for electrical signals and protection from external elements.
  • Bonding: Connects chip contact points to substrate contact points.
  • Molding finishes the chip package and seals it.

Summary

• The semiconductor chip manufacturing involves pre-processes (wafer processing) and post-processes (testing and packaging).
• This complex process contributes to the production of functional semiconductor chips.

Conclusion

• Understanding these processes provides insight into semiconductor chip manufacturing.
• Stay tuned for more episodes about semiconductors!