Altera Cyclone II FPGA Training Module

Jul 19, 2024

Training Module: Altera Cyclone II FPGA

Introduction

  • Overview of Cyclone II family FPGA
  • Definition of programmable logic
    • Configurable logic with programmable interconnections
    • Memory cells define logic functions and interconnections

FPGA Applications

  • Random logic, device controllers, communication encoding, filtering
  • Prototyping designs for gate arrays
  • Custom computing machines (executing software on programmable parts)

Altera's Approach

  • Complements CPLDs and FPGAs with:
    • Sophisticated software tools
    • Pre-verified, configurable IP cores
    • Software core processor (Nios II)
    • Development kits and reference designs
  • Benefits: Faster design process, faster time to market, lower development costs

Cyclone II Family Benefits

  • Extension of low-cost FPGA density range to 68,416 logic elements
  • Up to 622 usable I/O pins
  • Up to 1.1 megabits of embedded memory
  • Manufactured on 300mm wafers using TSMC's 90nm process
  • High performance and low power consumption
  • Supports complex digital systems on a single chip

Technical Features

  1. Embedded Multipliers

    • Up to two 9x9-bit multipliers or one 18x18-bit multiplier
    • Up to 250 MHz performance
  2. External Memory Interfaces

    • SDR SDRAM, DDR SDRAM, DDR2 SDRAM, QDR2 SRAM
    • Clock speeds up to 167 MHz for DDR and DDR2
    • Clock speeds up to 160 MHz for QDR2
  3. Phase-Locked Loops (PLLs)

    • Up to 4 PLLs per device
    • Advanced features: clock switchover, multiplication, division, phase shifting, programmable duty cycle
  4. Vertical Migration

    • Migratable within the same package (e.g., EP2C35 to EP2C70)
  5. Nios II Embedded Processor Support

    • Custom embedded processing solutions
    • Co-processing or replacing existing processors
  6. Quartus II Design Software

    • Supports all Cyclone II devices
    • Integration with SOPC builder and DSP builder for embedded and DSP applications

Architecture

  • Two-dimensional row and column-based architecture
  • Signal interconnections between logic array blocks, memory blocks, and multipliers
  • Logic Array Blocks (LABs) containing 16 logic elements (LEs)
    • Cyclone II devices range from 4608 to 68,416 LEs
    • LABs grouped into rows and columns

Interconnects and I/O Features

  • High-speed backplane applications and high-end switch boxes
  • Low Voltage Differential Signaling (LVDS)
    • Higher noise immunity, high-speed data rate transfers, low power consumption
    • Programmable drive strength control for various I/O standards

PCI Express and Hot Socketing

  • PCI Express: High performance, flexibility, scalability, and software compatibility
  • Hot Socketing: Insert/remove board during operation without affecting the system

I/O Banks and VREF Pins

  • Separate power buses for each I/O bank
  • Devices support varying numbers of I/O banks and VREF pins (e.g., EP2C5 devices - 4 I/O banks, EP2C70 devices - 8 I/O banks)

Clock Management with PLLs

  • Zero delay buffer, jitter attenuator, low skew fan-out buffer, frequency synthesizer
  • Four supported clock feedback modes: Normal, zero delay buffer, no compensation, source synchronous

Configuration

  • Active serial configuration using low-cost serial devices with non-volatile memory
    • Simple 4-pin interface, small form factor

Ideal Applications

  • Automotive, consumer, communications, video processing, test and measurement
  • Optimized for low-cost applications with a comprehensive feature set